Silicon ingot bonding material reduces waste

LORD Corporation uncrated a silicon ingot bonding material, LORD 781, developed for the silicon solar market. The material fills gaps and bonds Si ingots to reduce wire breaks and wasted wafers during silicon ingot slicing.

September 30, 2011 — Materials maker LORD Corporation uncrated a silicon ingot bonding material, LORD 781, developed for the solar photovoltaics market. The material, designed for automatic ingot slicing machine use, reduces wasted materials, machine uptime, and costs, according to LORD.

The epoxy adhesive is a two-component, thixotropic adhesive system for vertical or overhead surfaces. LORD 781 joins dissimilar ingot lengths, and fills gaps and end-face slopes, for easier ingot slicing. It is designed to reduce wear on the ingot slicing wire by preventing gaps. 4-6 silicon wafers can be lost for every unfilled gap in ingots, and wire breakage is common.

It develops high bond strength in 12-16 hours at room temperature. LORD 781 maintains excellent hardness and adhesion at high temperatures, and reduces the risk of wire jump. It can reduce Total Thickness Variation (TTV) and warping of silicon slices. The high viscosity material helps prevent ingot contamination and is low odor-emitting.

LORD Corporation designs, manufactures and markets mechanical devices and electromechanical systems to control vibration, motion and noise; formulates, produces and sells general purpose and specialty adhesives, coatings and electronic materials; and develops products and systems utilizing magnetically responsive technologies. Visit www.lord.com for more information.

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