Low-cost conductive adhesive for back-contact c-Si solar modules

Engineered Conductive Materials introduced the DB-1588 low-cost (40% less than silver-filled) conductive adhesive for back-contact applications in crystalline silicon solar modules.

November 7, 2011Engineered Conductive Materials LLC, conductive interconnect materials supplier for photovoltaic applications, introduced the DB-1588 low-cost conductive adhesive for back-contact applications in crystalline silicon solar modules.

The material costs 40% less than ECM?s standard silver-filled adhesive.

The conductive adhesives interconnect vias or other conductors to the back contact sheet. Its stress-absorption properties increase solar module reliability in thermal cycling. Conductivity is stable in damp heat exposure.

The DB-1588 cures during encapsulant lamination and cure.

ECM provides conductive stringer attach adhesives, conductive adhesives for back contact crystalline silicon, thin-film and via fill applications as well as conductive grid inks for photovoltaic applications. Engineered Conductive Materials, LLC (ECM) is a wholly-owned company of Engineered Materials Systems, Inc. (EMS). Learn more at www.conductives.com.

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