DuPont Signs PV Backsheet Deal

DuPont Photovoltaic Fluoromaterials (PVFM) announced that it has signed a Technology Licensing Agreement with Toppan Inc. Printing Co. LTD, located in Tokyo, Japan, to commercialize its new backsheet for solar photovoltaic (PV) modules.

This technical and business deal with Toppan is in line with the PVFM strategic intent to significantly increase the availability of DuPont Tedlar films and backsheet for the fast growing PV market, according to the company.

“This collaboration combines DuPont’s proprietary technology for Tedlar polymer in backsheets, with Toppan’s unique coating capability,” said Kelly Kolliopoulos, global business manager of DuPont’s Tedlar Division. “We view the new backsheet technology as complementary to our continuing activities to increase the supply of Tedlar films in order to meet the industry’s growth and demand for Tedlar.”

In a related story, DuPont Microcircuit Materials (MCM) announced the introduction of DuPont Solamet PV159 thick-film metallization paste for frontside photovoltaic (PV) solar cell metallization. According to DuPont, customers who have sampled Solamet PV159 have seen up to 0.5% efficiency improvement on wafers with shallower emitters compared to standard wafers, with substantial improvements also shown on many other wafer/emitter types.

“DuPont Solamet metallization materials, developed by our world class research team, have set the PV industry standard for many years by enabling customers to reduce costs, increase efficiency and enhance the competitiveness of their products,” said Peter Brenner, photovoltaics business manager for DuPont Microcircuit Materials.

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