DOW will showcase materials that aid in PV ingot slicing, thermal transfer, metallization, cleaning, and myriad other roles, such as encapsulating modules, at this year’s EU PVSEC in Valencia, Spain. Product descriptions are included.
(August 26, 2010 – BUSINESS WIRE) — The Dow Chemical Company (NYSE:DOW) will showcase its new solutions designed for photovoltaic manufacturers at this year’s 25th European Photovoltaic Solar Energy Conference and Exhibition (PVSEC) in Valencia, Spain (stand L3/H4/B4, Hall 4, Feria Valencia). Dow’s photovoltaic solutions can help increase solar cell efficiency and solar module durability, improve device performance at lower cost, and enable widespread adoption of solar energy, according to the company.
At the EU PVSEC booth:
Dow Adhesive and Functional Polymers business will showcase ADCOTE and MOR-FREE adhesives for module fabrication for long-term durability with improved environmental profile. ADCOTE adhesives exhibit excellent bonding strength properties, good UV stability, high thermal resistance and very good hydrolysis resistance. MOR-FREE solventless adhesives offer demonstrated laminating capabilities with an improved environmental profile.
Dow’s new innovative ENLIGHT Polyolefin Encapsulant Films used as protective encapsulants help lower total module system costs and provide for improved productivity and extended reliability. ENLIGHT Polyolefin Encapsulant Films’ processing and performance benefits can reduce cycle times and improve productivity when the module is produced, and help extend module reliability and service life when in use.
DOWTHERM and SYLTHERM heat transfer fluid solutions for solar grade silicon production. Dow offers SYLTHERM and DOWTHERM Fluids for Photovoltaic polysilicon purification processes as well as Concentrated Solar Power (CSP) industry applications. The fluids provide a wide choice of solutions for high and low temperature environments, with good thermo-stability.
Dow’s Polyglycol CF fluid for a higher quality experience in slicing silicon wafers. Dow Polyglycols, Surfactants and Fluids business is dedicating resources to the research of a new carrier fluid for the specialized slicing of silicone wafers. The carrier fluid disperses the abrasives, carries away heat, and provides more lubricity. The next generation fluid will enable a more stable and better quality cutting experience, promoting a reduction in slurry consumption.
Dow connects chemistry and innovation with the principles of sustainability in a portfolio of specialty chemical, advanced materials, agrosciences and plastics businesses. More information about Dow can be found at www.dow.com