Conductive-adhesives-for-solar-module-assembly: Henkel at EU PVSEC

Henkel will display some of the company’s recent innovations in electrically conductive adhesive (ECA) technology at EU PVSEC.  HYSOL ECCOBOND CE3103WLV is an electrically conductive adhesive designed for assembly of thin-film solar substrates. HYSOL ECCOBOND CA3556HF has been formulated to deliver low-temperature curing at 150°C and a cure time of 5 sec.

(September 2, 2010) — Henkel will display some of the company’s recent innovations in electrically conductive adhesive (ECA) technology at EU PVSEC.  These latest advances address the low stress, faster cure speeds and lower temperature curing requirements for modern thin-film and crystalline silicon (c-Si) module assembly

Henkel will exhibit at Hall1, Level 3, Stand A14 at the European Photovoltaic Solar Energy Conference (EU PVSEC) in Valencia, Spain.

Reducing module stress, particularly at the tabbing ribbon connection points, is key to high yield production and module in-field reliability but, to date, materials such as solder and high-temperature cure ECAs haven’t been able to effectively deliver on these demands.  Henkel has developed two ECAs that solve these issues. 

HYSOL ECCOBOND CE3103WLV is an electrically conductive adhesive designed for assembly of thin-film solar substrates and overcomes challenges with unstable contact resistance posed by older-generation ECAs. Based on research that concluded electrochemical corrosion on copper and tin in elevated temperature and humidity conditions was the primary culprit of contact resistance instability, Henkel developed advanced corrosion inhibition characteristics into HYSOL ECCOBOND CE3103WLV. The material enables stable electrical contact resistance between transparent conductive oxides (TCO) and tin terminations through 1000 hours of 85°C temperature at 85% relative humidity (RH).

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As an alternative to traditional solder connections used for c-Si solar modules which can be problematic for thin, fragile solar cells, HYSOL ECCOBOND CA3556HF has been formulated to deliver low-temperature curing at 150°C and a cure time of 5 sec. The material bonds Ag and SnPbAg coated tabs and the c-Si cells, delivering a stable and reliable electrical connection over the life of the module. Thin-film module manufacturers have also successfully incorporated this material into processes that dictate low-stress, fast curing interconnection of cells and ribbons.

For more information, visit www.henkel.com/electronics

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