centrotherm SiTec GmbH introduced a solar-grade silicon ingot sqaring tool and brick cropping system, based on diamond wafer saw technology.
July 15, 2011 — centrotherm SiTec GmbH introduced a solar-grade silicon ingot sqaring tool and brick cropping system, based on diamond wafer saw technology. This expands the company’s equipment range for integrated ingot and wafer production, which also includes ingot furnaces.
The automated ingot squaring equipment saws multi-crystalline silicon ingots into bricks. The brick cropping tool cuts these bricks to precise corresponding lengths for further sawing into wafers. The diamond wire saw technology boasts precision cuts, high productivity, and optimized production costs, according to the company.
The equipment is an alternative to slurry processing with silicon carbide/liquid cutting. centrotherm SiTec claims that it beats slurry processing in throughput, automation, load/unload times, and space requirements. For wafer-based PV, the crystalline silicon (c-Si) ingot raw material and slicing costs together amount to more than one third of the total module cost, according to Meeting current and future wafering challenges, by Philippe M. Nasch and Romain Sumi, Applied Materials.
The ingot squaring equipment offers 4,400 ingot/year capacity, producing around 110,000 bricks. The brick cropping equipment operates two bricks in parallel, giving it an annual capacity of around 40,000 bricks.
The tools debuted at Intersolar. Check out more news and new products from Intersolar North America here.
centrotherm photovoltaics AG, a wholly-owned subsidiary of centrotherm photovoltaics AG, provides technology and equipment for the photovoltaics manufacturing sector. Learn more at http://www.centrotherm-pv.com/en/