Adhesive improves solar silicon ingot sawing, dissolves in H20

Henkel Corporation introduced Loctite 3382, a water-debondable epoxy adhesive that bonds silicon and glass/metal mounting substrates during silicon ingot slicing operations, protecting against wafer breakage.

August 17, 2011 — Henkel Corporation introduced Loctite 3382, a water-debondable epoxy adhesive that bonds silicon and glass/metal mounting substrates during solar silicon ingot slicing operations, protecting against wafer breakage.

Loctite 3382 sets up in 5-7 hours, providing a consistent cutting layer, which Henkel states will reduce edge damage and wafer breakage. The epoxy cures to pink, giving operators a color distinction between silicon ingot and mounting substrates.

The adhesive breaks down in hot water, rather than caustic acids, for debonding. It will not debond prematurely during ingot slicing. The adhesive has no caustic odors, does not corrode equipment, and can be processed in current wafer cleaning solutions and processes.

Henkel operates worldwide in three business areas: Laundry & Home Care, Cosmetics/Toiletries, and Adhesive Technologies. Learn more at www.henkelna.com/solar.

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