Two European firms have partnered to combine manufacturing execution system (MES) software with optical measurement technology into an offering promising “total yield management” for solar PV production.
April 28, 2010 – Two European firms have partnered to combine manufacturing execution system (MES) software with optical measurement technology into an offering promising “total yield management” for solar PV production.
Despite much development and growth in production technology and volume of solar PV cells and modules, “the actual efficiency and quality of the production process has a lot of potential to achieve further cost reduction, longer lifetime, and higher efficiency, according to Reiner Missale, CEO of Portugal-based Critical Manufacturing, in a statement. “Combining the specific and unique inspection results of OSIS with the extensive traceability, analytics, and visualization of cmNAVIGO is a quantum leap for monitoring, tracking, and improving solar manufacturing productivity and quality,” added Germany-based Op-tection‘s managing director Wilbert Windeln. “The integration of both systems allows achieving a more detailed analysis of defects, determine failure trends, compare quality across the shop-floor, and have only one source of inspection data and production documentation.”
The combination of Critical Manufacturing’s cmNavito 2.0 MES and Op-tection’s (Germany) OSIS inspection tools and results, offers the following benefits, according to the companies:
Metrology data collection. Stores measurements and overall metrology parameters and data from Op-tection equipment:
- Wafer defects, thickness, and texture reflectivity
- Phosphoric acid weight and thickness, and refractive index of silicon nitride (SiNx) coating
- Cell and module electroluminescence defects.
It also processes parameter and data, through flexible samples and readings; aggregations and calculations; and online validations, warning and max/min limits. Full traceability and documentation are enabled for all material and process conditions throughout the manufacturing process.
Statistical process control. Combines collected metrology data per wafer and as trend, across the production floor and inspection tools:
- Online and offline chart display and distribution
- Table values, individual readings, comments, and exclusions
- Charts management, specification, and control limits
- Auto or manual control limit recalculation into most common variable and attributes charts, warnings for exceeded limits and process windows for increased product quality
- Reaction to limit violations through exception protocols (manual or automated).
Failure catalog. Visualizes the entire collection of defects, allowing deep-zoom of images for further analysis:
- Cracks, inclusions, grain density
- Shunts, dislocations, dark areas
- Dead cell(s) and strings.
Reports/graphics/dashboards. Condenses the inspection parameter, data, and images for entire manufacturing areas into a total visibility of themetrology and production data:
- Visualizing inspection results by tool, line, and entire factory
- Monitoring quality deficiencies, violations, and results
- Comparing metrology results of tools and production lines.