Solar

Dow opens commercial-scale PV polyolefin encapsulant film production

The Dow Chemical Company (NYSE:Dow) has begun commercial-scale manufacturing of ENLIGHT Polyolefin Encapsulant Films for use in photovoltaic solar panel modules at its state-of-the-art production line in Findlay, Ohio.

(December 16, 2010 – BUSINESS WIRE) — The Dow Chemical Company (NYSE:Dow) has begun commercial-scale manufacturing of ENLIGHT Polyolefin Encapsulant Films for use in photovoltaic solar panel modules at its state-of-the-art production line in Findlay, Ohio.

ENLIGHT technology was introduced earlier this year. “Our encapsulant films improve the ability of module manufacturers to lower their overall costs,” according to Brij Sinha, global strategic marketing manager for photovoltaics for Dow’s Packaging and Converting business. Sinha notes that the films allow faster processing speeds, which lead to lower conversion costs. “Just as important, ENLIGHT technology has demonstrated that it can help increase the reliability of the finished module.”

Dow offers two developmental grades of ENLIGHT Polyolefin Encapsulant Films, and also is developing customer-specific formulations. These films provide greater module stability and improved electrical performance versus traditional encapsulants, such as EVA-based products. The new encapsulant films are suitable for C-Si and thin-film modules.

“The extensive polyolefin film production capabilities of Dow’s Findlay operations make it the perfect site for manufacturing ENLIGHT Polyolefin Encapsulant Film formulations that are tailored to address the unique needs of customers around the world,” said Brian Brown, Findlay manufacturing site leader for Dow’s Packaging and Converting business.

The company plans to phase in production capacity around the world as needed to meet growing demand.

This latest encapsulant joins the ENLIGHT family of encapsulants, metallization, imaging, cleaning and texturizing materials sold to the photovoltaic market worldwide. These include ADCOTE Solvent-Based Adhesives, MOR-FREE Solventless Adhesives and ENLIGHT Liquid Encapsulants for flexible modules. More information about Dow can be found at www.dow.com.

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